INDEX-2 Microelectronics—Continued packaging techniques, 1-19 to 1-25 recent developments in packaging,     1-23 to 1-25 substrate production, 1-10, 1-12 introduction, 1-2 microelectronic system design concepts,   1-31 to 1-40 electrical considerations, 1-41 to 1-42 environmental considerations, 1-41 interconnection in printed circuit boards, 1-35 to 1-38 modular assemblies, 1-38 to 1-40 system packaging, 1-32 to 1-35 terminology, 1-31, 1-32 summary, 1-43 to 1-54 Miniature and microminiature repair procedures, 3-1 to 3-50 introduction, 3-1 miniature and microminiature electronic repair procedures, 3-1 to 3-37 conformal coatings, 3-2 to 3-7 installation and soldering of printed circuit components, 3-20 to 3-25 planar-mounted components (flat- packs), 3-29 removal and replacement of DIPs,      3-25 to 3-27 removal and replacement of discrete components, 3-7 to 3-19 removal and replacement of flat packs, 3-29 to 3-31 removal and replacement of TO packages, 3-27 to 3-29 repair of printed circuit boards and cards, 3-31 to 3-37 safety, 3-38 to 3-46 electrostatic discharge, 3-38 to 3-43 personal safety, 3-43 to 3-46 summary, 3-46 to 3-50 Miniature/Microminiature (2M) Repair Program and high-reliability soldering, 2-1 to 2-22 high-reliability soldering, 2-19 to 2-20 use of flux in solder bonding, 2-20 introduction, 2-1 Miniature/Microminiature (2M) Repair   levels of maintenance, 2-2 to 2-3 depot-level maintenance, 2-2 intermediate-level maintenance, 2-2 organizational-level maintenance, 2-3 Miniature and Microminiature (2M) Electronic Repair Program, 2-1 to 2-2 repair station facilities, 2-18 to 2-19 electrostatic discharge sensitive device (ESDS) capability, 2-19 lighting, 2-18 noise considerations, 2-19 power requirements, 2-19 ventilation, 2-18 to 2-19 work surface area, 2-19 repair stations, 2-6 to 2-19 circuit card holder and magnifier, 2-10 to 2-11 hand pieces, 2-7 to 2-8 hand-tools, 2-12 to 2-15 high-intensity light, 2-11 miscellaneous tools and supplies, 2-15 to 2-16 Pana Vise, 2-11 to 2-12 repair station power unit, 2-6 to 2-10 replacement parts, 2-18 rotary-drive machine, 2-9 to 2-10 safety equipment, 2-16 to 2-17 stereoscopic-zoom microscope, 2-17 to 2-18 tool chest, 2-18 source, maintenance, and recoverabilty (SM&R) codes, 2-3 summary, 2-21 to 2-22 test equipment, 2-3 to 2-6 built-in test equipment (BITE), 2-4 general-purpose electronic test equipment (GPETE), 2-5 to 2-6 off-line test equipment, 2-5 on-line test equipment, 2-4 to 2-5 Miscellaneous tools and supplies, 2-15 to 2-16 Modular assemblies, 1-38 to 1-40 N Noise considerations, 2-19