• Home
  • Download PDF
  • Order CD-ROM
  • Order in Print
Multilayer Printed Circuit Board - Continued - 14186_52
MODULAR ASSEMBLIES - Continued

Neets Module 14-Introduction to Microelectronics
Page Navigation
  34    35    36    37    38  39  40    41    42    43    44  
1-39 Figure 1-42.—Layer build-up technique. Advantages and Disadvantages of Printed Circuit Boards Some of the advantages and disadvantages of printed circuit boards were discussed earlier in this topic. They are strong, lightweight, and eliminate point-to-point wiring. Multilayer printed circuit boards allow more components per card. Entire circuits or even subsystems may be placed on the same card. However, these cards do have some drawbacks. For example, all components are wired into place, repair of cards requires special training and/or special equipment, and some cards cannot be economically repaired because of their complexity (these are referred to as THROWAWAYS). MODULAR ASSEMBLIES The MODULAR-ASSEMBLY (nonrepairable item) approach was devised to achieve ultra-high density packaging. The evolution of this concept, from discrete components to microelectronics, has progressed through various stages. These stages began with cordwood assemblies and functional blocks and led to complete subsystems in a single package. Examples of these configurations are shown in figure 1-43, view (A), view (B), and view (C).






Western Governors University

Privacy Statement
Press Release
Contact

© Copyright Integrated Publishing, Inc.. All Rights Reserved. Design by Strategico.