1
ASSIGNMENT 1
Textbook assignment: Chapter 1, “Microelectronics,” pages 1-1 through 1-56. Chapter 2,
“Miniature/Microminiature (2M) Repair Program and High-Reliability Soldering,” pages 2-1 through 2-22.
_____________________________________________________________________________________
1-1. What term is used to describe electronic
systems that are made up of extremely
small parts or elements?
1. Microelectronics
2. Modular packages
3. Integrated circuits
4. Solid-state technology
1-2. During World War II, which of the
following limitations were considered
unacceptable for military electronics
systems?
1. Large size, heavy weight, and wide
bandwidth
2. Excessive power requirements, large
size, and complex manning
requirements
3. Large size, heavy weight, and
excessive power requirements
4. Heavy weight, complex circuits and
limited communications range
1-3. The development of which of the
following types of components had the
greatest impact on the technology of
microelectronics?
1. Vacuum tubes and resistors
2. Transformers and capacitors
3. Vacuum tubes and transistors
4. Transistors and solid-state diodes
1-4. For a vacuum tube to operate properly in
a variety of different circuit
applications, additional components are
often required to "adjust" circuit values.
This is because of which of the
following variations within the vacuum
tube?
1. Element size
2. Warm-up times
3. Plug-in mountings
4. Output characteristics
1-5. Point to point wiring in a vacuum tube
circuit often caused which of the
following unwanted conditions?
1. Heat interactions
2. Inductive interactions
3. Capacitive interactions
4. Both 2 and 3 above
1-6. Functional blocks of a system that can
easily be removed for troubleshooting
and repair are called
1. sets
2. chassis
3. modules
4. vacuum tubes
