3 1-15.     Integrated circuits containing more than 64,000 bits of memory are referred to as   1.    hybrid integration   2.    large-scale integration   3.    small-scale integration   4.    very large-scale integration 1-16.     Which of the following pieces of equipment is used to prepare component layout in complex ICs?   1.    A mask   2.    A camera   3.    A computer   4.    A microscope 1-17.     A device that allows the depositing of material in selected areas of a semiconductor substrate, but not in others, is known as a   1.    blind   2.    screen   3.    filter   4.    wafer mask 1-18.     Which of the following types of material is preferred for film circuit substrates?   1.    Silicon   2.    Ceramic   3.    Germanium   4.    Fiberglass 1-19.     A typical silicon wafer has approximately (a) what diameter and (b) what thickness?   1.    (a) 2 inches (b) 0.01 to 0.02 inches   2.    (a) 2 inches (b) 0.21 to 0.40 inches   3.    (a) 3 inches (b) 0.21 to 0.40 inches   4.    (a) 3 inches (b) 0.01 to 0.20 inches 1-20.     Artificially grown silicon or germanium crystals are used to produce substrates for which of the following types of integrated circuits?   1.    Hybrid   2.    Thin-film   3.    Thick-film   4.    Monolithic 1-21.     Elements penetrate the semiconductor substrate in (a) what type of IC but (b) do NOT penetrate the substrate in what type of IC?   1.    (a) Diffused     (b) thin-film   2.    (a) Diffused     (b) epitaxial   3.    (a) Thick-film  (b) epitaxial   4.    (a) Thick-film  (b) thin-film 1-22.     Pn junctions are protected from contamination during the fabrication process by which of the following materials?   1.    Oxide   2.    Silicon   3.    Germanium   4.    Photoetch 1-23.     The prevention of unwanted interaction or leakage between components is accomplished by which of the following techniques?   1.    Isolation   2.    Insulation   3.    Integration   4.    Differentiation