INDEX-3
O
Off-line test equipment, 2-5
On-line test equipment, 2-4 to 2-5
Organizational-level maintenance, 2-3
P
Package lead identification (numbering), IC,
1-27 to 1-28
Packaging techniques, 1-19 to 1-25
Pana Vise, 2-11 to 2-12
Personal safety, 3-43 to 3-46
Planar-mounted components (flat-packs), 3-29
Power requirements, 2-19
Power unit, repair station, 2-6 to 2-10
Printed circuit boards and cards, repair of, 3-31
to 3-37
Printed circuit components, installation and
soldering of, 3-20 to 3-25
R
Recent developments in packaging, 1-23 to
1-25
Reference list, AII-1
Repair station facilities, 2-18 to 2-19
Repair stations, 2-6 to 2-19
Replacement parts, 2-18
Rotary-drive machine, 2-9 to 2-10
S
Safety, 3-38 to 3-46
Safety equipment, 2-16 to 2-17
Shielding and ground planes, 1-41 to 1-42
Solder, 2-19 to 2-20
Solid-state devices, 1-5 to 1-8
Source, maintenance, and recoverability
(SM&R) codes, 2-3
State-of-the-art microelectronics, 1-7, 1-8
Stereoscopic-zoom microscope, 2-17 to 2-18
Substrate production, 1-10, 1-12
System design concepts, microelectronic, 1-31
to 1-40
System packaging, 1-32 to 1-35
T
Terminology, 1-31, 1-32
Test equipment, 2-3 to 2-6
TO packages, removal and replacement of,
3-27 to 3-29
Tool chest, 2-18
Training and certification, 2-1 to 2-2
2-M electronic repair program, (miniature and
microminiature), 2-1 to 2-2
V
Vacuum-tube equipment, 1-2 to 1-4
Ventilation, 2-18 to 2-19
W
Work surface area, 2-19
