INDEX-1 MODULE 14  INDEX B Built-in test equipment, 2-4 C Circuit card holder and magnifier, 2-10 to 2-11 Component arrangement, 1-9, 1-10 Conformal coatings, 3-2 to 3-7 D Depot-level maintenance, 2-2 DIPs, removal and replacement of, 3-25 to 3-27 Discrete components, removal and replacement of, 3-7 to 3-19 E Electrical considerations, 1-41 to 1-42 Electronic repair procedures, miniature and microminiature, 3-1 to 3-37 Electrostatic discharge (ESD), 3-38 to 3-43 Electrostatic discharge sensitive device (ESDS) capability, 2-19 Environmental considerations, 1-41 Equivalent circuits, 1-25 to 1-31 Evolution of microelectronics, 1-2 to 1-9 F Fabrication of microelectronic devices, 1-8 to 1-25 Film circuits, 1-14 to 1-18 thick film, 1-17 thin film, 1-14 Flat packs, removal and replacement of, 3-29 to 3-31 Flux in solder bonding, use of, 2-20 G General-purpose electronic test equipment, (GPETE), 2-5 to 2-6 Glossary, AI-1 to AI-4 H Hand tools, 2-12 to 2-16 High-intensity light, 2-11 High-reliability soldering, 2-19, 2-20 Hybrid microcircuits, 1-17 to 1-19 I IC devices, fabrication of, 1-12 to 1-19 IC identification, 1-28 to 1-31 Installation and soldering of printed circuit components, 3-20 to 3-25 Integrated circuits, 1-6, 1-7 Interconnection in printed circuit boards, 1-35 to 1-38 Intermediate-level maintenance, 2-2 L Learning objectives, 1-1, 2-1, 3-1 Levels of maintenance, 2-2 to 2-3 depot-level maintenance, 2-2 intermediate-level maintenance, 2-2 organizational-level maintenance, 2-3 Lighting, 2-18 M Magnifier and circuit card holder, 2-10 to 2-11 Microelectronics, 1-1 to 1-54 equivalent circuits, 1-25 to 1-31 IC identification, 1-28 to 1-31 IC package lead identification (numbering), 1-27 to 1-28 evolution of microelectronics, 1-2 to 1-9 integrated circuits, 1-6, 1-7 solid-state devices, 1-5 to 1-8 state-of-the-art microelectronics, 1-7, 1-8 vacuum-tube equipment, 1-2 to 1-4 fabrication of microelectronic devices, 1-8 to 1-25 component arrangement, 1-9, 1-10 fabrication of IC devices, 1-12 to 1-19