AI-4
THIN FILM COMPONENTS—Passive circuit elements (resistors and capacitors) deposited on a
substrate to a thickness of 0.0001 centimeter.
VACUUM EVAPORATION—Process of producing thin film components.
VERY LARGE SCALE INTEGRATION (vlsi)—An integrated circuit containing over 2,000 logic
gates or 64,000 bits of memory.
WAFER—A slice of semiconductor material upon which monolithic ICs are produced.
