4
1-24. Vacuum evaporation and cathode
sputtering are two methods used to
produce which of the following types of
components?
1. Diodes
2. Thin-film
3. Thick-film
4. Transistors
1-25. To deposit highly reactive materials on a
substrate, which of the following
methods is used?
1. Photoetching
2. Photolithography
3. Cathode sputtering
4. Vacuum evaporation
1-26. To produce thin film resistors, which of
the following materials is/are used?
1. Nichrome
2. Tantalum
3. Titanium
4. Each of the above
1-27. Which of the following is a major
advantage of hybrid ICs?
1. Ease of manufacture
2. Ease of replacement
3. Design flexibility
4. Easy availability
1-28. IC packaging is required for which of
the following reasons?
1. To dissipate heat
2. For ease of handling
3. To increase shelf life
4. To meet stowage requirements
_______________________________________
IN ANSWERING QUESTIONS 1-29 AND
1-30, MATCH THE IC PACKING EXAMPLES
IN THE QUESTIONS TO THE PACKAGING
DESCRIPTIONS IN FIGURE 1A.
A.
TO
B. DIP
C. Flatpack
D. Hybrid
Figure 1A.
Packaging descriptions.
_______________________________________
1-29.
1. A
2. B
3. C
4. D
1-30.
1. A
2. B
3. C
4. D
