5
1-31. Which of the following types of DIPs
are most commonly used in the Navy's
microelectronics systems?
1. Glass
2. Metal
3. Ceramic
4. Plastic
1-32. In IC production, gold or aluminum
bonding wires are used for which of the
following purposes?
1. To bond the chip to the package
2. To provide component isolation
3. To connect the package to the
circuit board
4. To connect the chip to the package
leads
1-33. IC packages that may be easily installed
by hand or machine on mounting boards
fall into which of the following
categories?
1. TO
2. DIP
3. Flatpack
4. Each of the above
1-34. The need for bonding wires has been
eliminated by which of the following
production techniques?
1. LSI
2. Beam lead
3. Flip chip
4. Both 2 and 3 above
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