7
1-41. An assembly of microcircuits or a
combination of microcircuits and
discrete components is referred to as a
1. mother board
2. microprocessor
3. miniature module
4. microcircuit module
1-42. A technician has isolated a problem to a
plug-in module on a printed circuit
board. What is this level of system
packaging?
1. Level O
2. Level I
3. Level II
4. Level III
1-43. A faulty transistor would be identified
as what level of packaging?
1. Level O
2. Level I
3. Level II
4. Level III
1-44. A chassis located in a radar antenna
pedestal would be identified as what
level of system packaging?
1. Level I
2. Level II
3. Level III
4. Level IV
1-45. Which of the following characteristics is
NOT an advantage of multilayer printed
circuit boards?
1. Allows greater wiring density on
boards
2. Provides shielding for a large
number of conductors
3. Eliminates complicated wiring
harnesses
4. Reduces the number of components
per board
1-46. Which of the following circuit
connection methods is NOT used in
making interconnections on a multilayer
printed circuit board interconnection?
1. Terminal lug
2. Clearance hole
3. Layer build-up
4. Plated-through hole
1-47. The most complex to produce and
difficult to repair printed circuit boards
are those made using which of the
following methods?
1. Layer-buildup
2. Clearance-hole
3. Step-down-hole
4. Plated-through-hole
1-48. Environmental performance
requirements for ICs are set forth in
which of the following publications?
1. 2M repair manual
2. Military Standards
3. System maintenance manuals
4. Manufacturer's data sheet
