12
2-13. When unsoldering a MOSFET from a
printed circuit board, you should avoid
using a vacuum plunger solder sucker for
which of the following reasons?
1. Solder suckers can generate high
electrostatic charges that can damage
MOSFETs
2. Solder suckers create a vacuum that
can physically damage MOSFETs
3. Solder suckers are not authorized for
any type of equipment repair
4. Solder suckers require the use of a
high wattage soldering iron that may
damage MOSFETs
Figure 2F. —MOSFET (enhancement type) and
equivalent circuit.
IN ANSWERING QUESTION 2-14, REFER
TO FIGURE 2F.
2-14. When comparing resistance readings of
an enhancement type of MOSFET to
those of a depletion/enhancement type of
MOSFET, which, if any, of the following
differences should you notice?
1. The resistance between the substrate
and the gate of the enhancement type
should be less than 15 ohms
2. The measurement between the drain
and source of the enhancement type
should read infinite regardless of
meter lead polarity
3. The resistances between the gate and
the drain and between the gate and the
source of the enhancement type
should be noticeably higher
4. None of the above
2-15. Which of the following is/are (an)
advantage(s) of integrated circuits when
compared to circuits made up of separate
components and interconnections?
1. Lower power consumption
2. Smaller size of the equipment
3. Lower equipment cost
4. All of the above
2-16. Which of the following is a characteristic
of linear ICs?
1. They do not require regulated power
supplies
2. They are typically sensitive to their
supply voltages
3. They are never classed as electrostatic
discharge sensitive devices
4. They are comparable in size to their
equivalent transistor circuits
