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CHAPTER 3
MINIATURE AND MICROMINIATURE REPAIR
PROCEDURES
LEARNING OBJECTIVES
Upon completion of this topic, the student will be able to:
1. Explain the purpose of conformal coatings and the methods used for removal and replacement of
these coatings.
2. Explain the methods and practices for the removal and replacement of discrete components on
printed circuit boards.
3. Identify types of damage to printed circuit boards, and describe the repair procedures for each
type of repair.
4. Describe the removal and replacement of the dual-in-line integrated circuit.
5. Describe the removal and replacement of the TO-5 integrated circuit.
6. Describe the removal and replacement of the flat-pack integrated circuit.
7. Describe the types of damage to which many microelectronic components are susceptible and
methods of preventing damage.
8. Explain safety precautions as they relate to 2M repair.
INTRODUCTION
As you progress in your training as a technician, you will find that the skill and knowledge levels
required to maintain electronic systems become more demanding. The increased use of miniature and
microminiature electronic circuits, circuit complexity, and new manufacturing techniques will make your
job more challenging. To maintain and repair equipment effectively, you will have to duplicate with
limited facilities what was accomplished in the factory with extensive facilities. Printed circuit boards that
were manufactured completely by machine will have to be repaired by hand.
To meet the needs for repairing the full range of electronic equipment, you must be properly trained.
You must be capable of performing high-quality, reliable repairs to the latest circuitry.
MINIATURE AND MICROMINIATURE ELECTRONIC REPAIR PROCEDURES
As mentioned at the beginning of topic 2, 2M repair personnel must undergo specialized training.
They are trained for a particular level of repair and must be certified at that level. Also, recertification is
required to ensure the continued high-quality repair ability of these technicians.
