ALLOWANCE PARTS LIST (APL)Repair parts required for unit having the equipment/ component
ALLOWANCE EQUIPAGE LIST (AEL)Equipment requirements for a unit having the exact
BEAM-LEAD CHIPSemiconductor chip with electrodes (leads) extended beyond the wafer.
BONDING WIRESFine wires connecting the bonding pads of the chip to the external leads of the
BUILT-IN TEST EQUIPMENT (BITE)Permanently mounted to the equipment for the purpose of
testing the equipment.
CABLE HARNESSA group of wires or ribbons of wiring used to interconnect electronic systems and
CATHODE SPUTTERINGProcess of producing thin film components.
CERMETA combination of powdered precious-metal alloys and an inorganic material such as
alumina. Used in manufacturing resistors, capacitors, and other components for high-temperature
CORDWOOD MODULE.A method of increasing the number of discrete components in a given
space. Resembles wood stacked for a fireplace.
CRYSTAL FURNACE.Device for artificially growing cylindrical crystals for producing semi-
DEPOT-LEVEL MAINTENANCE (SM&R Code D)Supports S&R Code I and SM&R Code O
activities through extensive shop facilities and equipment and more highly skilled personnel.
DIE BONDINGProcess of mounting a chip to a package.
DIFFUSIONControlled application of impurity atoms to a semiconductor substrate.
DISCRETE COMPONENTSIndividual transistors, diodes, resistors, capacitors, and inductors.
DUAL IN-LINE PACKAGE (DIP)IC package having two parallel rows of preformed leads.
ENCAPSULATEDImbedded in solid material or enclosed in glass or metal.