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SUMMARY - 14186_138
SUMMARY - Continued - 14186_140

Neets Module 14-Introduction to Microelectronics
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3-47 Component LEADS are terminated either through the board, above the board, or on the board. SOLDER may be removed by wicking, by a manual vacuum plunger, or by a continuous vacuum solder extractor. ELECTRONIC ASSEMBLIES should be restored to the original manufacturer's standards using the same orientation and termination method.






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