EPITAXIAL PROCESSThe depositing of a thin uniformly doped crystalline region (layer) on a
EUTECTIC ALLOYAn alloy that changes directly from a solid to a liquid with no plastic or
EUTECTIC SOLDERAn alloy of 63 percent tin and 37 percent lead. Melts at 361º F.
FILM ICsConductive or nonconductive material deposited on a glass or ceramic substrate. Used for
passive circuit components, resistors, and capacitors.
FLAT PACKIC package.
FLIP CHIPMonolithic IC packaging technique that eliminates need for bonding wires.
FLUXRemoves surface oxides from metals being soldered.
GENERAL PURPOSE ELECTRONIC TEST EQUIPMENT (GPETE)Multimeters, oscilloscopes,
voltmeters, signal generators, etc.
GROUND PLANESCopper planes-used to minimize interference between circuits and from external
HYBRID ICsTwo or more integrated circuit types, or one or more integrated circuit types and discrete
components on a single substrate.
INTEGRATED CIRCUIT (IC)Elements inseparably associated and formed on or within a single
INTERMEDIATE-LEVEL MAINTENANCE (SR&R Code I)Direct support and technical
assistance to user organizations. Tenders and shore-based repair facilities.
ISOLATIONThe prevention of unwanted interaction or leakage between components.
LANDSConductors or runs on pcbs.
LARGE SCALE INTEGRATION (lsi)An integrated circuit containing 1,000 to 2,000 logic gates or
up to 64,000 bits of memory.
MASKA device used to deposit materials on a substrate in the desired pattern.
MICROCIRCUITA small circuit having high equivalent-circuit-element density, which is considered
as a single part composed of interconnected elements on or within a single substrate to perform an
MICROELECTRONICSThat area of electronics technology associated with electronic systems built
of extremely small electronic parts or elements.
MICROCIRCUIT MODULEAn assembly of microcircuits or a combination of microcircuits and
discrete components that perform one or more distinct functions.
MODIFIED TRANSISTOR OUTLINE (TO)IC package resembling a transistor.