MODULAR PACKAGINGCircuit assemblies or subassemblies packaged to be easily removed for
maintenance or repair.
MODULEA circuit or portion of a circuit packaged as a removable unit. A separable unit in a
packaging scheme displaying regularity of dimensions.
MILITARY STANDARDS (MILSTD)Standards of performance for components or equipment that
must be met to be acceptable for military systems.
MINIATURE ELECTRONICSModules, packages, pcbs, and so forth, composed exclusively of
2MMiniature/Microminiature repair program.
MONOLITHIC ICICs that are formed completely within a semiconductor substrate. Silicon chips.
OFF-LINE TEST EQUIPMENTTests andisolates faults in modules or assemblies removed from
OHMS PER SQUAREThe resistance of any square area of thin film resistive material as measured
between two parallel sides.
ON-LINE TEST EQUIPMENTContinuously monitors the performance of electronic systems.
ORGANIZATIONAL-LEVEL MAINTENANCE (SM&R Code O)Responsibility of the user
PACKAGING LEVELSSystem developed to assist maintenance personnel in isolating faults.
PHOTO ETCHINGChemical process of removing unwanted material in producing printed circuit
POINT-TO-POINT WIRINGIndividual wires run from terminal to terminal to complete a circuit.
PRINTED CIRCUIT BOARD (peb)The general term for completely processed printed circuit or
printed wiring configurations. It includes single-layered, double-layered, and multi-layered
SCREENINGProcess of applying nonconductive or semiconductive materials to a substrate to form
thick film components.
SHIELDINGTechnique designed to minimize internal and external interference.
SOURCE, MAINTENANCE, AND RECOVER-ABILITY CODES (SM&R CODES)Specify
maintenance level for repair of components or assemblies.
SUBSTRATEMounting surface for integrated circuits. May be semiconductor or insulator material
depending on type of IC.
THICK FILM COMPONENTSPassive circuit components (resistors and capacitors) having a
thickness of 0.001 centimeter.