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ASSIGNMENT 2
Textbook assignment: Chapter 2, “Wiring Techniques,” pages 2-24 through 2-53.
Chapter 3, “Schematic Reading,” pages 3-1 through 3-24.
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2-1. Why must materials to be soldered be
cleaned just prior to the soldering
process?
1. To ensure the solder will adhere to
the surface
2. To prevent the solder from
becoming brittle from impurities
and eventually failing
3. To prevent an uneven flow of solder
to the surface
4. Each of the above
2-2. What is meant by the term "tinning"?
1. Removing the oxide coating of the
material to be soldered
2. Preheating the material to be
soldered to remove any impurities
left from the stripped insulation
3. Coating the material to be soldered
with a light coat of solder
4. Applying pure tin to the material to
be soldered to ensure adherence of
the solder
2-3. When a wire is soldered to a connector,
why should the wire be stripped
approximately 1/32 inch longer than the
depth of the solder barrel?
1. To prevent burning the wire
insulation
2. To allow the wire to flex more
easily at stress points
3. Both 1 and 2 above
4. To prevent the flux from touching
the insulation
2-4. When a wire has been properly stripped
and is to be soldered to a connector, what
total length of the exposed wire should
be tinned?
1. One-third
2. One-half
3. Two-thirds
4. The entire exposed length
2-5. What action generally causes a fractured
solder joint?
1. Movement of the soldered parts
during the cooling process
2. Application of too much heat to the
parts
3. Introduction of impurities to the
joint from dirty solder or flux
4. Application of too much solder to
the joint
2-6. What term defines the capacity of a
soldering iron to generate and maintain a
satisfactory soldering temperature while
giving up heat to the joint being
soldered?
1. Iron current flow
2. Thermal inertia
3. Resistance soldering
4. Self-regulating heat
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