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Assignment Questions - 14186_162
Assignment Questions - 14186_164

Neets Module 14-Introduction to Microelectronics
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7 1-41.     An assembly of microcircuits or a combination of microcircuits and discrete components is referred to as a   1.    mother board   2.    microprocessor   3.    miniature module   4.    microcircuit module 1-42.     A technician has isolated a problem to a plug-in module on a printed circuit board.   What is this level of system packaging?   1.    Level O   2.    Level I   3.    Level II   4.    Level III 1-43.     A faulty transistor would be identified as what level of packaging?   1.    Level O   2.    Level I   3.    Level II   4.    Level III 1-44.     A chassis located in a radar antenna pedestal would be identified as what level of system packaging?   1.    Level I   2.    Level II   3.    Level III   4.    Level IV 1-45.     Which of the following characteristics is NOT an advantage of multilayer printed circuit boards?   1.    Allows greater wiring density on boards   2.    Provides shielding for a large number of conductors   3.    Eliminates complicated wiring harnesses   4.    Reduces the number of components per board 1-46.     Which of the following circuit connection methods is NOT used in making interconnections on a multilayer printed circuit board interconnection?   1.    Terminal lug   2.    Clearance hole   3.    Layer build-up   4.    Plated-through hole 1-47.     The most complex to produce and difficult to repair printed circuit boards are those made using which of the following methods?   1.    Layer-buildup   2.    Clearance-hole   3.    Step-down-hole   4.    Plated-through-hole 1-48.     Environmental performance requirements for ICs are set forth in which of the following publications?   1.    2M repair manual   2.    Military Standards   3.    System maintenance manuals   4.    Manufacturer's data sheet






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