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Assignment Questions - 14186_159
Assignment Questions - 14186_161

Neets Module 14-Introduction to Microelectronics
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4 1-24.     Vacuum evaporation and cathode sputtering are two methods used to produce which of the following types of components?   1.    Diodes   2.    Thin-film   3.    Thick-film   4.    Transistors 1-25.     To deposit highly reactive materials on a substrate, which of the following methods is used?   1.    Photoetching   2.    Photolithography   3.    Cathode sputtering   4.    Vacuum evaporation 1-26.     To produce thin film resistors, which of the following materials is/are used?   1.    Nichrome   2.    Tantalum   3.    Titanium   4.    Each of the above 1-27.     Which of the following is a major advantage of hybrid ICs?   1.    Ease of manufacture   2.    Ease of replacement   3.    Design flexibility   4.    Easy availability 1-28.     IC packaging is required for which of the following reasons?   1.    To dissipate heat   2.    For ease of handling   3.    To increase shelf life   4.    To meet stowage requirements _______________________________________ IN ANSWERING QUESTIONS 1-29 AND      1-30, MATCH THE IC PACKING EXAMPLES IN THE QUESTIONS TO THE PACKAGING DESCRIPTIONS IN FIGURE 1A.      A. TO   B.     DIP   C.    Flatpack   D.    Hybrid Figure 1A. Packaging descriptions. _______________________________________ 1-29.      1.    A   2.    B   3.    C   4.    D 1-30.      1.    A   2.    B   3.    C   4.    D






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