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Assignment Questions - 14186_160
Assignment Questions - 14186_162

Neets Module 14-Introduction to Microelectronics
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5 1-31.     Which of the following types of DIPs are most commonly used in the Navy's microelectronics systems?   1.    Glass   2.    Metal   3.    Ceramic   4.    Plastic 1-32.     In IC production, gold or aluminum bonding wires are used for which of the following purposes?   1.    To bond the chip to the package   2.    To provide component isolation   3.    To connect the package to the circuit board   4.    To connect the chip to the package leads 1-33.     IC packages that may be easily installed by hand or machine on mounting boards fall into which of the following categories?   1.    TO   2.    DIP   3.    Flatpack   4.    Each of the above 1-34.     The need for bonding wires has been eliminated by which of the following production techniques?   1.    LSI   2.    Beam lead   3.    Flip chip   4.    Both 2 and 3 above THIS SPACE LEFT BLANK INTENTIONALLY.






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