18 2-52.     To ensure a good mechanical bond between the board and replacement pad and to provide good electrical contact for components, which of the following procedures is used?   1.    Epoxying the pad to the run   2.    Electroplating the repair area   3.    Installing an eyelet in the pad   4.    Lap-flow soldering the repair area 2-53.     Breaks, holes, and cracks in pcbs are repaired by using a mixture of   1.    fiberglass and rosin   2.    epoxy and powdered carbon   3.    conformal coating and RTV   4.    epoxy and powdered fiberglass 2-54.     What is the first step in the repair of burned or scorched boards?   1.    Filling the burned area with epoxy and fiberglass   2.    Removing all discolored material   3.    Removing all delaminated conductors   4.    Cleaning all surfaces with solvent 2-55.     Which of the following statements is correct concerning the repair of repairable delaminated conductors?   1.    All delaminations are removed   2.    Repairable delaminations are not removed   3.    All delaminations are epoxied to the board   4.    All delaminations are replaced with insulated wire 2-56.     Damage to some electronic components can occur at what minimum electrostatic potential?   1.        14 volts   2.        35 volts   3.      350 volts   4.    3,500 volts 2-57.     Electrostatic discharge (ESD) has the greatest effect on which of the following devices?   1.    Silicon diodes   2.    Selenium rectifiers   3.    Germanium transistors   4.    Metal-oxide transistor Figure 2C. Symbol.    IN ANSWERING QUESTION 2-58, REFER TO FIGURE 2C.    2-58.     The symbol shown in the figure is found on a component package.   What does it indicate about the component?   1.    It is a high cost item   2.    It is a bipolar device   3.    It is an integrated circuit   4.    It is electrostatic discharge sensitive 2-59.     Electrostatic charges may develop as high as which of the following voltages?   1.      3,000 volts   2.    15,000 volts   3.    20,000 volts   4.    35,000 volts