17 2-44. What is the most critical step in replacing an imbedded TO? 1. Seating the leads 2. Forming the leads 3. Soldering the leads 4. Seating the body of the TO 2-45. When a TO or a DIP is replaced on a printed circuit board, what type of termination is normally used? 1. Lap flow 2. On-the-board 3. Above-the-board 4. Through-the-board 2-46. What type of termination is used in the replacement of a flat pack? 1. Lap flow 2. Solder cup 3. Solder plug 4. Full fillet 2-47. Heating the leads and lifting them free with tweezers is the preferred method of removing which of the following components? 1. TOs 2. DIPs 3. Flat packs 4. Transistors 2-48. Which of the examples shows the correct lead formation for a flat pack? 2-49. Use of a skipping pattern when solderingmultilead components prevents 1. cold solder joints 2. excessive heat buildup 3. the component from moving 4. the need to visually inspect the piece 2-50. Cards and boards may be damaged under which of the following conditions? 1. When unauthorized repairs are attempted by untrained personnel 2. When technicians use improper tools 3. When improperly stored 4. Each of the above 2-51. DS3 Spark is preparing to repair a cracked conductor on a card. For this type of damage, which of the following repair methods is preferred? 1. Solder bridge 2. Clinched staple 3. Install an eyelet at the crack and solder in place 4. Lap-flow soldered wire across the break
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