17
2-44. What is the most critical step in replacing
an imbedded TO?
1. Seating the leads
2. Forming the leads
3. Soldering the leads
4. Seating the body of the TO
2-45. When a TO or a DIP is replaced on a
printed circuit board, what type of
termination is normally used?
1. Lap flow
2. On-the-board
3. Above-the-board
4. Through-the-board
2-46. What type of termination is used in the
replacement of a flat pack?
1. Lap flow
2. Solder cup
3. Solder plug
4. Full fillet
2-47. Heating the leads and lifting them free
with tweezers is the preferred method of
removing which of the following
components?
1. TOs
2. DIPs
3. Flat packs
4. Transistors
2-48. Which of the examples shows the correct
lead formation for a flat pack?
2-49. Use of a skipping pattern when soldering
multilead components prevents
1. cold solder joints
2. excessive heat buildup
3. the component from moving
4. the need to visually inspect the piece
2-50. Cards and boards may be damaged under
which of the following conditions?
1. When unauthorized repairs are
attempted by untrained personnel
2. When technicians use improper tools
3. When improperly stored
4. Each of the above
2-51. DS3 Spark is preparing to repair a cracked
conductor on a card. For this type of
damage, which of the following repair
methods is preferred?
1. Solder bridge
2. Clinched staple
3. Install an eyelet at the crack and solder
in place
4. Lap-flow soldered wire across the
break
