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REPAIR OF PRINTED CIRCUIT BOARDS AND CARDS
REPAIR OF PRINTED CIRCUIT BOARDS AND CARDS - Continued - 14186_125

Neets Module 14-Introduction to Microelectronics
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3-32 Figure 3-23.—Pcb conductor damage. CRACK REPAIR.—Four techniques are used to repair cracks in printed circuit conductors. One method is to flow solder across the crack to form a solder bridge. This is not a high-reliability repair since the solder in the break will crack easily. The second method is to lap-solder a piece of wire across the crack. This method produces a stronger bond than a solder bridge; but it is not highly reliable, as the solder may crack. A third repair technique is to drill a hole through the board where the crack is located and then to install an eyelet in the hole and solder it into place. The fourth method is to use the clinched-staple method, shown in figure 3-24. It is the most reliable method and is recommended in nearly all cases.






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