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Lead Terminations - Continued - 14186_106
Component Desoldering - Continued - 14186_108

Neets Module 14-Introduction to Microelectronics
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3-15 Figure 3-9.—On-the-board termination. Q6.   What term is used to identify the procedure of connecting one side of a circuit board with the other? Q7.   Name two types of through-hole termination. Q8.   Turret, bifurcated, and hook terminals are used for what type of termination? Q9.   When a lead is soldered to a pad without passing through the board, it is known as what type of termination? Component Desoldering Most of the damage in printed circuit board repair occurs during disassembly or component removal. More specifically, much of this damage occurs during the desoldering process. To remove components for repair or replacement, the technician must first determine the type of joint that is used to connect the component to the board. The technician may then determine the most effective method for desoldering these connections. Three generally accepted methods of solder connection removal involve the use of SOLDER WICK, a MANUALLY CONTROLLED VACUUM PLUNGER, or a motorized solder extractor using CONTINUOUS VACUUM AND/OR PRESSURE. Of all the extraction methods currently in use, continuous vacuum is the most versatile and reliable. Desoldering becomes a routine operation and the quantity and quality of desoldering work increases with the use of this technique. SOLDER WICKING.—IN this technique, finely stranded copper wire or braiding (wick) is saturated with liquid flux. Most commercial wick is impregnated with flux; the liquid flux adds to the effectiveness of the heat transfer and should be used whenever possible. The wick is then applied to a solder joint between the solder and a heated soldering iron tip, as shown in figure 3-10. The combination of heat, molten solder, and air spaced in the wick creates a capillary action and causes the solder to be drawn into the wick.






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