CHAPTER 1 MICROELECTRONICS
INTRODUCTION
VACUUM-TUBE EQUIPMENT
VACUUM-TUBE EQUIPMENT - Continued
SOLID-STATE DEVICES
INTEGRATED CIRCUITS
STATE-OF-THE-ART MICROELECTRONICS.
FABRICATION OF MICROELECTRONIC DEVICES
COMPONENT ARRANGEMENT
SUBSTRATE PRODUCTION
SUBSTRATE PRODUCTION - Continued
FABRICATION OF IC DEVICES
Monolithic Fabrication - Continued
Thin Film
Thin Film - Continued - 14186_29
Thin Film - Continued - 14186_30
Thick Film
Hybrid Microcircuit
PACKAGING TECHNIQUES
Transitor-Outline Package - Continued
Flat Pack
Flat Pack - Continued
Dual Inline Package
RECENT DEVELOPMENTS IN PACKAGING
EQUIVALENT CIRCUITS
J-K FLIP-FLOP AND IC SIZES - Continued
IC PACKAGE LEAD IDENTIFICATION (NUMBERING)
IC PACKAGE LEAD IDENTIFICATION (NUMBERING) - Continued
IC IDENTIFICATION
Figure 1-33.Manufacturer's Data Sheet.
Figure 1-34.Manufacturer's Data Sheet.
MICROELECTRONIC SYSTEM DESIGN CONCEPTS
Microcircuit Module
Levels of Packaging
Levels of Packaging - Continued
INTERCONNECTIONS IN PRINTED CIRCUIT BOARDS
Multilayer Printed Circuit Board - Continued - 14186_51
Multilayer Printed Circuit Board - Continued - 14186_52
MODULAR ASSEMBLIES
MODULAR ASSEMBLIES - Continued
Cordwood Modules.
ENVIRONMENTAL CONSIDERATIONS
Interconnection and Intraconnections
SUMMARY - 14186_58
SUMMARY - Continued - 14186_59
SUMMARY - Continued - 14186_60
SUMMARY - Continued - 14186_61
SUMMARY - Continued - 14186_62
SUMMARY - Continued - 14186_63
SUMMARY - Continued - 14186_64
SUMMARY - Continued - 14186_65
SUMMARY - Continued - 14186_66
SUMMARY - Continued - 14186_67
ANSWERS TO QUESTIONS Q1. THROUGH Q50. - 14186_68
ANSWERS TO QUESTIONS Q1. THROUGH Q50. - 14186_69
ANSWERS TO QUESTIONS Q1. THROUGH Q50. - 14186_70
CHAPTER 2 MINIATURE/MICROMINIATURE (2M) REPAIR PROGRAM AND HIGH-RELIABILITY SOLDERING
LEVELS OF MAINTENANCE
SOURCE, MAINTENANCE, AND RECOVERABILITY (SM&R) CODES .
BUILT-IN TEST EQUIPMENT
GENERAL-PURPOSE ELECTRONIC TEST EQUIPMENT (GPETE)
REPAIR STATIONS - 14186_76
REPAIR STATIONS - 14186_77
Figure 2-3.Motorized solder extrator.
Soldering Irons - 14186_79
CIRCUIT CARD HOLDER AND MAGNIFIER
HIGH-INTENSITY LIGHT
HAND TOOLS
Pliers
Tweezers
Eyelet-Setting Tools
SAFETY EQUIPMENT
STEREOSCOPIC-ZOOM MICROSCOPE
REPAIR STATION FACILITIES
HIGH-RELIABILITY SOLDERING
USE OF FLUX IN SOLDER BONDING
SUMMARY - 14186_91
ANSWERS TO QUESTIONS Q1. THROUGH Q14.
CHAPTER 3 MINIATURE AND MICROMINIATURE REPAIR PROCEDURES
CONFORMAL COATINGS
Table 3-1.Conformal Coating Removal Techniques
Conformal Coating Removal - Continued - 14186_96
Conformal Coating Removal - Continued - 14186_97
Conformal Coating Removal - Continued - 14186_98
REMOVAL AND REPLACEMENT OF DISCRETE COMPONENTS
Interconnections and Assemblies - Continued
Lead Terminations
Lead Terminations - Continued - 14186_102
Lead Terminations - Continued - 14186_103
Lead Terminations - Continued - 14186_104
Lead Terminations - Continued - 14186_105
Lead Terminations - Continued - 14186_106
Component Desoldering
Component Desoldering - Continued - 14186_108
Component Desoldering - Continued - 14186_109
Component Desoldering - Continued - 14186_110
Component Desoldering - Continued - 14186_111
INSTALLATION AND SOLDERING OF PRINTED CIRCUIT COMPONENTS
Lead-Forming Specifications. - Continued - 14186_113
Lead-Forming Specifications. - Continued - 14186_114
Soldering of PCB Components
Soldering of PCB Components - Continued
REMOVAL AND REPLACEMENT OF DIPS
Removal of Plug-In DIPs
REMOVAL AND REPLACEMENT OF TO PACKAGES
REMOVAL AND REPLACEMENT OF TO PACKAGES - Continued
PLANAR-MOUNTED COMPONENTS (FLAT-PACKS)
Flat-Pack Replacement - Continued
REPAIR OF PRINTED CIRCUIT BOARDS AND CARDS
REPAIR OF PRINTED CIRCUIT BOARDS AND CARDS - Continued - 14186_124
REPAIR OF PRINTED CIRCUIT BOARDS AND CARDS - Continued - 14186_125
Repair of Cracked Boards
Broken Board Repair
Burned Board Repair
Burned Board Repair - Continued
SAFETY
ELECTROSTATIC DISCHARGE - Continued
Prevention of ESD Damage
Prevention of ESD Damage - Continued
Grounded Work Benches
PERSONAL SAFETY
Power Tools
Cleaning Solvents
SUMMARY - 14186_138
SUMMARY - Continued - 14186_139
SUMMARY - Continued - 14186_140
SUMMARY - Continued - 14186_141
ANSWERS TO QUESTIONS Q1. THROUGH Q36. - 14186_142
ANSWERS TO QUESTIONS Q1. THROUGH Q36. - 14186_143
Appendix I Glossary - 14186_145
Appendix I - Continued - 14186_146
Appendix I - Continued - 14186_147
Appendix I - Continued - 14186_148
Appendix II Reference List - 14186_149
Index - Continued - 14186_151
Index - Continued - 14186_152
Index - Continued - 14186_153
Assignment Questions - 14186_155
Assignment Questions - 14186_157
Assignment Questions - 14186_158
Assignment Questions - 14186_159
Assignment Questions - 14186_160
Assignment Questions - 14186_161
Assignment Questions - 14186_162
Assignment Questions - 14186_163
Assignment Questions - 14186_164
Assignment Questions - 14186_165
Assignment Questions - 14186_166
Assignment Questions - 14186_167
Assignment Questions - 14186_168
Assignment Questions - 14186_169
Assignment Questions - 14186_170
Assignment Questions - 14186_171
Assignment Questions - 14186_172
Assignment Questions - 14186_173
Assignment Questions - 14186_174
Assignment Questions - 14186_175
INTRODUCTION
VACUUM-TUBE EQUIPMENT
VACUUM-TUBE EQUIPMENT - Continued
SOLID-STATE DEVICES
INTEGRATED CIRCUITS
STATE-OF-THE-ART MICROELECTRONICS.
FABRICATION OF MICROELECTRONIC DEVICES
COMPONENT ARRANGEMENT
SUBSTRATE PRODUCTION
SUBSTRATE PRODUCTION - Continued
FABRICATION OF IC DEVICES
Monolithic Fabrication - Continued
Thin Film
Thin Film - Continued - 14186_29
Thin Film - Continued - 14186_30
Thick Film
Hybrid Microcircuit
PACKAGING TECHNIQUES
Transitor-Outline Package - Continued
Flat Pack
Flat Pack - Continued
Dual Inline Package
RECENT DEVELOPMENTS IN PACKAGING
EQUIVALENT CIRCUITS
J-K FLIP-FLOP AND IC SIZES - Continued
IC PACKAGE LEAD IDENTIFICATION (NUMBERING)
IC PACKAGE LEAD IDENTIFICATION (NUMBERING) - Continued
IC IDENTIFICATION
Figure 1-33.Manufacturer's Data Sheet.
Figure 1-34.Manufacturer's Data Sheet.
MICROELECTRONIC SYSTEM DESIGN CONCEPTS
Microcircuit Module
Levels of Packaging
Levels of Packaging - Continued
INTERCONNECTIONS IN PRINTED CIRCUIT BOARDS
Multilayer Printed Circuit Board - Continued - 14186_51
Multilayer Printed Circuit Board - Continued - 14186_52
MODULAR ASSEMBLIES
MODULAR ASSEMBLIES - Continued
Cordwood Modules.
ENVIRONMENTAL CONSIDERATIONS
Interconnection and Intraconnections
SUMMARY - 14186_58
SUMMARY - Continued - 14186_59
SUMMARY - Continued - 14186_60
SUMMARY - Continued - 14186_61
SUMMARY - Continued - 14186_62
SUMMARY - Continued - 14186_63
SUMMARY - Continued - 14186_64
SUMMARY - Continued - 14186_65
SUMMARY - Continued - 14186_66
SUMMARY - Continued - 14186_67
ANSWERS TO QUESTIONS Q1. THROUGH Q50. - 14186_68
ANSWERS TO QUESTIONS Q1. THROUGH Q50. - 14186_69
ANSWERS TO QUESTIONS Q1. THROUGH Q50. - 14186_70
CHAPTER 2 MINIATURE/MICROMINIATURE (2M) REPAIR PROGRAM AND HIGH-RELIABILITY SOLDERING
LEVELS OF MAINTENANCE
SOURCE, MAINTENANCE, AND RECOVERABILITY (SM&R) CODES .
BUILT-IN TEST EQUIPMENT
GENERAL-PURPOSE ELECTRONIC TEST EQUIPMENT (GPETE)
REPAIR STATIONS - 14186_76
REPAIR STATIONS - 14186_77
Figure 2-3.Motorized solder extrator.
Soldering Irons - 14186_79
CIRCUIT CARD HOLDER AND MAGNIFIER
HIGH-INTENSITY LIGHT
HAND TOOLS
Pliers
Tweezers
Eyelet-Setting Tools
SAFETY EQUIPMENT
STEREOSCOPIC-ZOOM MICROSCOPE
REPAIR STATION FACILITIES
HIGH-RELIABILITY SOLDERING
USE OF FLUX IN SOLDER BONDING
SUMMARY - 14186_91
ANSWERS TO QUESTIONS Q1. THROUGH Q14.
CHAPTER 3 MINIATURE AND MICROMINIATURE REPAIR PROCEDURES
CONFORMAL COATINGS
Table 3-1.Conformal Coating Removal Techniques
Conformal Coating Removal - Continued - 14186_96
Conformal Coating Removal - Continued - 14186_97
Conformal Coating Removal - Continued - 14186_98
REMOVAL AND REPLACEMENT OF DISCRETE COMPONENTS
Interconnections and Assemblies - Continued
Lead Terminations
Lead Terminations - Continued - 14186_102
Lead Terminations - Continued - 14186_103
Lead Terminations - Continued - 14186_104
Lead Terminations - Continued - 14186_105
Lead Terminations - Continued - 14186_106
Component Desoldering
Component Desoldering - Continued - 14186_108
Component Desoldering - Continued - 14186_109
Component Desoldering - Continued - 14186_110
Component Desoldering - Continued - 14186_111
INSTALLATION AND SOLDERING OF PRINTED CIRCUIT COMPONENTS
Lead-Forming Specifications. - Continued - 14186_113
Lead-Forming Specifications. - Continued - 14186_114
Soldering of PCB Components
Soldering of PCB Components - Continued
REMOVAL AND REPLACEMENT OF DIPS
Removal of Plug-In DIPs
REMOVAL AND REPLACEMENT OF TO PACKAGES
REMOVAL AND REPLACEMENT OF TO PACKAGES - Continued
PLANAR-MOUNTED COMPONENTS (FLAT-PACKS)
Flat-Pack Replacement - Continued
REPAIR OF PRINTED CIRCUIT BOARDS AND CARDS
REPAIR OF PRINTED CIRCUIT BOARDS AND CARDS - Continued - 14186_124
REPAIR OF PRINTED CIRCUIT BOARDS AND CARDS - Continued - 14186_125
Repair of Cracked Boards
Broken Board Repair
Burned Board Repair
Burned Board Repair - Continued
SAFETY
ELECTROSTATIC DISCHARGE - Continued
Prevention of ESD Damage
Prevention of ESD Damage - Continued
Grounded Work Benches
PERSONAL SAFETY
Power Tools
Cleaning Solvents
SUMMARY - 14186_138
SUMMARY - Continued - 14186_139
SUMMARY - Continued - 14186_140
SUMMARY - Continued - 14186_141
ANSWERS TO QUESTIONS Q1. THROUGH Q36. - 14186_142
ANSWERS TO QUESTIONS Q1. THROUGH Q36. - 14186_143
Appendix I Glossary - 14186_145
Appendix I - Continued - 14186_146
Appendix I - Continued - 14186_147
Appendix I - Continued - 14186_148
Appendix II Reference List - 14186_149
Index - Continued - 14186_151
Index - Continued - 14186_152
Index - Continued - 14186_153
Assignment Questions - 14186_155
Assignment Questions - 14186_157
Assignment Questions - 14186_158
Assignment Questions - 14186_159
Assignment Questions - 14186_160
Assignment Questions - 14186_161
Assignment Questions - 14186_162
Assignment Questions - 14186_163
Assignment Questions - 14186_164
Assignment Questions - 14186_165
Assignment Questions - 14186_166
Assignment Questions - 14186_167
Assignment Questions - 14186_168
Assignment Questions - 14186_169
Assignment Questions - 14186_170
Assignment Questions - 14186_171
Assignment Questions - 14186_172
Assignment Questions - 14186_173
Assignment Questions - 14186_174
Assignment Questions - 14186_175
