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P-TYPE SEMICONDUCTOR
JUNCTION BARRIER - 14179_52

Neets Module 07-Introduction to Solid-State Devices and Power Supplies
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1-39 A PN JUNCTION CONSTRUCTION varies from one manufacturer to the next. Some of the more commonly used manufacturing techniques are: GROWN, ALLOY or FUSED-ALLOY, DIFFUSED, and POINT-CONTACT. CURRENT FLOW in an N-TYPE MATERIAL is similar to conduction in a copper wire. That is, with voltage applied across the material, electrons will move through the crystal toward the positive terminal just like current flows in a copper wire.






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