Quantcast Figure 3-9.Wafer switch

Share on Google+Share on FacebookShare on LinkedInShare on TwitterShare on DiggShare on Stumble Upon
Custom Search
 
  
 
3-10 Figure 3-9(A) shows one wafer of a wafer switch and its schematic symbol. Contact 1 is the point at which current enters the wafer. It is always connected to the movable portion of the wafer. With the wafer in the position shown, contact 1 is connected to both contact 5 and 6 through the movable portion. If the movable portion was rotated slightly clockwise, contact 1 would only be connected to contact 5. This arrangement is known as MAKE BEFORE BREAK because the switch makes a contact before breaking the old contact. Figure 3-9.—Wafer switch. Figure 3-9(B) is an illustration of the entire switch and its schematic symbol. Since the switch has two wafers mechanically connected by the shaft of the switch, the shaft rotates the movable portion of both wafers at the same time. This is represented on the schematic symbol by the dotted line connecting the two wafers. The upper wafer of the schematic symbol is the wafer closest to the control mechanism, and is identical to the wafer shown in figure 3-9(A). When switches have more than one wafer, the first wafer shown is always the wafer closest to the operating mechanism. The lower wafer on the schematic diagram is the wafer farthest away from the operating mechanism. Contact 9 of this wafer is connected to the movable portion and is the point at which current enters the wafer. In the position shown, contact 9 is connected to both contact 13 and 16. If the switch is rotated slightly clockwise, contact 9 would no longer be connected to contact 13. A further clockwise movement would connect contact 9 to contact 12. This arrangement is called BREAK BEFORE MAKE. Contact 9 will also be connected to contact 15 at the same time as it is connected to contact 12. Q9.   Label the switch schematics shown in figure 3-10A through 3-10G.


Electrical News
FCC Chief at MWC: 'No One Blocks Internet'
FCC Chairman Tom Wheeler, at the Mobile World Congress, compared...
eetimes.com
NXP CEO: 'Security, IoT, Cars' Drove Freescale Deal
NXP CEO spoke with on the overlapping businesses with Freescale,...
eetimes.com
Spectrum, 5G in MWC Spotlight
To avoid a massive and unruly cellular frequency shakeup, a...
eetimes.com
Making MCU Software Requirements Creation Easier
To reduce labor and error in requirements definition and verification...
eetimes.com
Rohde & Schwarz highlights 5G tester at MWC
To support designers and developers in research activities, Rohde &...
eetimes.com
IoT Security a Prime Focus for Freescale
Security is a major concern in the Internet of Things,...
eetimes.com
MEMS Windmills for Energy Harvesting?
Fabricated from nickel-based alloys using MEMS techniques and processes, micro-windmills...
eetimes.com
Unleash The Power of JavaScript For IoT
Marvell has open-sourced its software crown jewel, KinomaJS. Marvell, which...
eetimes.com
IBM, Semtech 30-Mile IoT Uses 10-Year AAs
IBM and Semtech go long into machine-to-machine (M2M) working with...
eetimes.com
EEVblog #720 – Mailbag
Dave opens his mail. SPOILERS: Chip Whisperer KickStarter Supermicro Xeon...
eevblog.com
Graphics API Gets Makeover
With new proprietary graphics interfaces out from AMD, Apple and...
eetimes.com
Locking Down IoT Security
The Internet of Things is a central to many business...
eetimes.com
Altium Updates High-Speed PCB Design Tool
Altium next update to its flagship PCB design tool, Altium...
eetimes.com
Telcos Demand 'Level-Playing Field' With Apps Giants
Telco operators at Mobile World Congress called for a "level...
eetimes.com
Spansion Adds RAM to HyperBus
Combination of new HyperRAM and HyperFlash connected to a common...
eetimes.com
Embedded Job Market Expands, But Boomers Feel the Squeeze
By almost any measure, the job market appears to be...
eetimes.com
NXP, Freescale: Bigger Not Better
The proposed merger of NXP and Freescale creates a embedded...
eetimes.com
Intel Tablet SoCs Pack LTE
Intel announced a new family of SoCs and modems for...
eetimes.com
Asian Share of Global Fab Capacity May Top 69% by 2019
Asia is expected to account for a new record, nearly...
eetimes.com
Save Me From Overbearing IoT Analytics
Will Internet of Things analytics drive us all to drink?...
eetimes.com
 


Privacy Statement - Copyright Information. - Contact Us

comments powered by Disqus

Integrated Publishing, Inc.
9438 US Hwy 19N #311 Port Richey, FL 34668

Phone For Parts Inquiries: (727) 755-3260
Google +